nav emailalert searchbtn searchbox tablepage yinyongbenwen piczone journalimg journalInfo journalinfonormal searchdiv searchzone qikanlogo popupnotification paper paperNew
2017, 11, v.41 1273-1278
银粉形貌及粒径对无铅导电银浆性能的影响
基金项目(Foundation): 国家自然科学基金项目(51262017,51362017); 云南省稀贵金属先进材料协同创新中心协同创新基金项目(14051708)资助
邮箱(Email):
DOI: 10.13373/j.cnki.cjrm.xy16060003
发布时间: 2016-09-08
出版时间: 2016-09-08
网络发布时间: 2016-09-08
移动端阅读
摘要:

通过银粉的不同形貌、粒径以及级配研究其对无铅导电银浆烧结后膜层的电阻率和附着力的影响。选取了平均粒径为0.50,0.91,2.09,3.36μm的球形银粉和4.3μm的片状银粉,首先将5种银粉各自制备成无铅导电银浆,选出银浆性能最优的银粉,再将此银粉搭配纳米级银粉和片状银粉制备无铅导电银浆。通过扫描电子显微镜(SEM)观察浆料烧结银膜的形貌,用四探针测试仪测量烧结银膜的电阻率,通过拉伸试验测试烧结银膜的附着力,讨论了银粉形貌及粒径对无铅导电银浆烧结膜附着力和电阻率的影响。结果表明,当为纯球形银粉或片状银粉时,球形银粉制备的银浆电阻率和附着力最优,且球形银粉粒径为0.91μm时最优,电阻率为33.3μΩ·cm,附着力为3.193 N;添加纳米级银粉能改善银浆的电性能,在添加量为4%时最优,电阻率为30.9μΩ·cm,附着力为3.253 N;添加片状银粉的含量在8%时最优,电阻率为27.7μΩ·cm,附着力为3.478 N。

Abstract:

The effect of particle size and morphology distribution of silver powders on electrical resistivity and adhesion of silver film was investigated. Four kinds of spherical silver powder with mean particle size of 0. 5,0. 91,2. 09,3. 36 μm and one kind of flake silver powder with mean particle size of 4. 3 μm were adopted. Firstly,five kinds of silver pastes were prepared and the optimal performance of the silver paste with silver powder was attained,then the powder was mixed with flake silver and nano-silver powder and the lead-free conductive silver paste was obtained. The morphology of the paste sintered silver film was observed by scanning electron microscope( SEM),and the electrical resistivity was analyzed by the four-point probe meter,and the adhesion was tested by pull test.The effects of particle size and morphology on electrical resistivity and adhesion of silver film were discussed. The results showed that when morphology of silver was spherical and particle size was 0. 91 μm,the optimal electrical resistivity and adhesion of the silver paste could be obtained. And electrical resistance was 33. 3 μΩ·cm and adhesion was 3. 193 N. Nano-silver powder could improve the electrical properties of silver. And when the addition was 4%,the optimal electrical resistivity and adhesion of the silver paste could be obtained. And electrical resistance was 30. 9 μΩ·cm and adhesion was 3. 253 N. When the flake silver content was 8%,the electrical resistivity and adhesion of the silver film were the best. And electrical resistance was 27. 7 μΩ·cm and adhesion was 3. 478 N.

参考文献

[1]Lai Y B,Guo Z C,Huang H,Zhang H Y,Wang S.Synthesis of monodisperse micrometer-sized spherical silver particles[J].Journal of Materials Science&Engineering,2014,32(2):219.(赖耀斌,郭忠诚,黄惠,张红艳,王帅.单分散微米球形银粉的制备工艺[J].材料科学与工程学报,2014,32(2):219.)

[2]Tian Q H,Li Y,Deng D,Guo X Y.Preparation of spherical ultrafine silver powder using gum arabic as dispersant[J].Chinese Journal of Rare Metals,2015,39(9):818.(田庆华,李宇,邓多,郭学益.阿拉伯树胶作分散剂制备超细球形银粉[J].稀有金属,2015,39(9):818.)

[3]Gan W P,Luo J,Guo G Q,Xiang F,Liu H.Preparation of ultra-fine silver powder used in electronic paste by chemical reduction[J].Electronic Components and Materials,2010,29(11):15.(甘卫平,罗贱,郭桂全,向锋,刘欢.化学还原法制备电子浆料用超细银粉[J].电子元件与材料,2010,29(11):15.)

[4]Zheng Y,Gan G Y,Yan J K,Du J H,Yi J H,Chen ZW,Zhang L.Optimization on particle size of micron spherical silver powder[J].Rare Metal Materials and Engineering,2012,41(9):1623.(郑娅,甘国友,严继康,杜景红,易健宏,陈忠文,张磊.微米球形银粉粒径的优化分析[J].稀有金属材料与工程,2012,41(9):1623.)

[5]Yan J K,Teng Y,Yan F C,Li W L,Du J H,Gan G Y,Yi J H.Study on the sintering process of silver paste on Auto rear glass hot wires[J].Precious Metals,2015,36(A01):118.(严继康,滕媛,闫方存,李文琳,杜景红,甘国友,易健宏.汽车后挡风玻璃加热线银浆的烧结工艺研究[J].贵金属,2015,36(A01):118.)

[6]Qin J,Zhang W J,Bai S X,Liu Z F.Effect of Pb-TeO glasses on Ag thick-film contact in crystalline silicon solar cells[J].Solar Energy Materials&Solar Cells,2016,144:256.

[7]Yang H,Chen C K,Wang H,Cao D Y,Lei X D.Impact of interface microstructure on adhesion force between silver paste and silicon solar cells'emitter[J].Clean Technologies&Environmental Policy,2014,16(3):655.

[8]Liu Q,Ren M S,Liu Z Y,Xu J W,Wang X J,Liu N.Study and market of front-side silver paste for silicon solar cell[J].Information Recording Materials,2012,13(2):39.(柳青,任明淑,刘子英,徐建伟,王小记,刘宁.晶体硅太阳能电池正面银导电浆料的研究进展[J].信息记录材料,2012,13(2):39.)

[9]Che Q D,Yang H X,Lu L,Wang Y H.A new environmental friendly silver front contact paste for crystalline silicon solar cells[J].Journal of Alloys&Compounds,2013,549(5):221.

[10]Tsai J T,Lin S T.Silver powder effectiveness and mechanism of silver paste on silicon solar cells[J].Journal of Alloys&Compounds,2013,548(105):105.

[11]Zhou J H,Xu N X,Yang H,Zhang Q L.Effect of Ag powder and glass frit in Ag paste on front contract of silicon solar cells[J].Procedia Engineering,2014,94(6):1.

[12]Yan F C,Teng Y,Yan J K,Du J H,Yi J H,Gan G Y.Effects of flake silver powder on electrical properties of solar cells silver paste[J].Journal of Functional Materials and Devices,2015,(4):31.(闫方存,滕媛,严继康,杜景红,易健宏,甘国友.片状银粉对太阳能电池银浆料电性能影响研究[J].功能材料与器件学报,2015,(4):31.)

[13]Xie X Z,Liu X Y,Yuan C L.Effect of silver particle size and morphology distribution on the performance of lead-free silver paste[J].Rare Metal Materials and Engineering,2015,(12):3113.(谢湘洲,刘心宇,袁昌来.银粉粒径及形貌搭配对无铅导体浆料性能的影响[J].稀有金属材料与工程,2015,(12):3113.)

[14]Xiong N N,Wang Y H,Li J Z.Review of recent advances in nano-silver-filled conductive pastes[J].Rare Metal Materials and Engineering,2015,(10):2589.(熊娜娜,王悦辉,李晶泽.纳米银填充导电浆料的研究进展[J].稀有金属材料与工程,2015,(10):2589.)

[15]Park K J,Seo D S,Lee J K.Conductivity of silver paste prepared from nanoparticles[J].Colloids&Surfaces A Physicochemical&Engineering Aspects,2008,313(1):351.

[16]Li W,Wu T,Jiao R B,Zhang B P,Li S Y,Zhou Y,Li L L.Effects of silver nanoparticles on the firing behavior of silver paste on crystalline silicon solar cells[J].Colloids&Surfaces A Physicochemical&Engineering Aspects,2015,466(466):132.

[17]Seo D S,Park S H,Lee J K.Sinterability and conductivity of silver paste with Pb-free frit[J].Current Applied Physics,2009,9(1):572.

[18]GB/T17473.4-2008.Test methods of precious metals pastes pastes used for microelectronics-Determination of adhesion[S].2008.(GB/T17473.4-2008.微电子技术用贵金属浆料测试方法附着力测定[S].2008.)

基本信息:

DOI:10.13373/j.cnki.cjrm.xy16060003

中图分类号:TM24

引用信息:

[1]滕媛,闫方存,李文琳,等.银粉形貌及粒径对无铅导电银浆性能的影响[J].稀有金属,2017,41(11):1273-1278.DOI:10.13373/j.cnki.cjrm.xy16060003.

基金信息:

国家自然科学基金项目(51262017,51362017); 云南省稀贵金属先进材料协同创新中心协同创新基金项目(14051708)资助

发布时间:

2016-09-08

出版时间:

2016-09-08

网络发布时间:

2016-09-08

检 索 高级检索

引用

GB/T 7714-2015 格式引文
MLA格式引文
APA格式引文